Electronics Forum | Wed Jun 10 15:10:55 EDT 1998 | Rich
I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over c
Electronics Forum | Thu Aug 06 13:09:37 EDT 1998 | Ben Salisbury
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Fri Feb 15 17:50:30 EST 2008 | stevek
Creating a sound tin nickel intermetalic takes a bit more energy than other finishes (such as copper or tin). You can achieve wetting, but not have a viable intermetalic. You should cross section some intact boards from that process and see what th
Electronics Forum | Thu Jun 14 04:24:32 EDT 2012 | brettrenishaw
Yes pads are still gold after the wave soldering process even if you wave solder a pcb several times. I have tried soldering using an iron and the solder takes to the pad as you would expect. This happens on all boards of this type and all boards are
Electronics Forum | Thu Jun 27 08:48:08 EDT 2002 | yngwie
I was approached by the comp. suplier to change the capacitors that I currently used. No change in elect. charateristic, but only on : a) change of palladium to nickel base inner electrode b) outer electrode material i.e. from silver to copper. Que
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Mon May 10 20:46:25 EDT 2004 | davef
The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a
Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper
Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t
Electronics Forum | Wed Mar 26 12:15:11 EDT 2008 | patrickbruneel
Hi all, I wanted to share this with y�all, because it�s informative on what is to come but at the same time hilarious. ******************************************************** From Dr. Craig Hillman (DfR Solutions) RoHS 2 Moves Forward (Run For Yo
