Electronics Forum | Mon Oct 04 18:48:43 EDT 2010 | rsthompson
I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions on this and I'm wondering what some of you are doin
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Tue Oct 15 13:40:23 EDT 2002 | greenman
I'm currently trying to get a feel for what oxygen level I will need in my lead-free assembly process. Do I need to go with the pure vaporized liquid nitrogen, or can I get away with one of the other "on-demand" operations? All assistance gratefully
Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy
IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Thu Jan 22 10:21:46 EST 2015 | charliedci
I am curious to know how others are providing N2 for their lead free selective soldering process. If you are utilizing a nitrogen generator, is it a PSA type or Membrane type? I am trying to get a handle on nitrogen purity and what purity is necessar
Electronics Forum | Wed Oct 06 08:55:23 EDT 1999 | Brian Conner
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Fri Nov 22 13:41:55 EST 2002 | cristiano
We are experiencing problems with a smartmedia connector during the reflow solder process. The connectors stay a little bended after the oven. In this case the middle leads are not solded, because they stay with no contact on the board. The conector
Electronics Forum | Wed Dec 26 16:52:57 EST 2012 | davef
"Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework" Author: Brook Sandy, Edward Briggs and Ronald Lasky, Ph.D. Abstract: The increased function of personal electronic devices, such as mobile phones and personal mus
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
