Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas
We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
Electronics Forum | Wed Sep 07 00:28:04 EDT 2011 | woodsmt
I have identified a Board design issue and having trouble convincing others of my findings. I have a BGA (Sn63 balls, +1500 IO, 0.6mm ball, 1mm pitch, with heat spreader plate)that has a high incidence of solder shorting on the corners. The board i
Electronics Forum | Wed Jun 23 15:49:30 EDT 1999 | Kelly Morris
In the IPC-SM-782 (Surface Mount Design and Land Pattern Standard) it recommends a minimum of .040" between bottomside wavesoldered chip pads. Where might I find a similar IPC recommendation for minimum space between thru-hole pads? Does anyone kno
Electronics Forum | Wed Sep 21 04:53:13 EDT 2005 | Slaine
go beat the designer over the head until he separates the pads or uses solder mask.
Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Fri Feb 07 16:10:14 EST 2003 | MA/NY DDave
Hi Gee, It seems funny to comment on your own post. I notice that the original poster and a respondent, like me, are striving to create some voiding by design to improve the way this joint will form. NEAT!! I still think that those vias as DaveF p
Electronics Forum | Fri Dec 27 14:11:18 EST 2002 | cnotebaert
We have placed these parts. I have not had problems with them but when I designed the stencil we reduced the app for the large thermal by 20% to reduce the chance of problems like your having. If the balls are close (.040-.050" or
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