Electronics Forum | Fri Jan 30 18:24:09 EST 2009 | gsala
Buenas dias Jos�, It shoul not be a problem. We had situation like that when in the early 2006 the Lead Free fase in Pb fase out, no pbm on solder joints. Today, after about 3 years, those cards are stil working in the field without any defect. Reg
Electronics Forum | Tue Feb 03 10:25:56 EST 2009 | milroy
Hi What is the surface finish you have? Following are true if you have HASL-LeadFree surface. I have had the same problem 3years ago and we did some micro-sectioning for further analysis, still the boards are functioning properly. But you have to
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 31 17:34:37 EDT 2013 | hegemon
Keep in mind that you may need to assure that there are no pure tin finishes remaining on your parts. A general idea is that parts with pure tin (RoHs) finish will need to be plated with tin-lead solder to avoid the possibility of tin whiskers formi
Electronics Forum | Thu Mar 22 17:38:44 EST 2001 | davef
OK, lemme take a different angle on this, �cuz I forgot to touch on this when I first responded. I mentioned a study ["Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low-Residue Soldering Task Force"
Electronics Forum | Tue Jan 25 07:49:17 EST 2005 | davef
On "Solder beading seemed to be a problem", consider revisiting the thermal recipe used for reflow. The PTH barrel may not be getting warm enough. On "Component not being designed to pin in paste work, with no proper standoffs", consider: * Using a
Electronics Forum | Mon Feb 23 23:50:18 EST 1998 | mike
| Does anyone have any experience with via in pad for | BGAs using conventional thru hole technology? | Steve Joy Steve, I had a customer who had designed a board to use a BGA socket. Well the socket did not work out so we then placed the bga dire
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Electronics Forum | jonhood42 |
Wed Sep 04 11:37:12 EDT 2013
