Electronics Forum | Wed Sep 08 11:04:41 EDT 1999 | Timothy O'Neill
| I am using a 18 mil and below water soluble solder paste (89.5-25-80). I have never used this type of paste. The PCB has a fine pitch component of which I cannot prevent bridging. The paste coverage on the pad looks like it is slumping. It is not a
Electronics Forum | Wed Dec 06 16:14:25 EST 2006 | realchunks
Assuming you meant 38 percent humidity - I would have to say your environment is only part of the problem. When you experience this problem, is because the paste has set idle for a period of time? If you knead the paste does the fine pitch print OK
Electronics Forum | Fri Apr 23 11:42:30 EDT 2004 | patrickbruneel
Thanks for the answer. what i believe happent is that the manufacturer of the paste reduced the tackiness of the paste to eliminate the squeegee sticking problem, and now with the reduced tack its a lot easier for the powder particles to break off du
Electronics Forum | Wed Jan 30 17:23:07 EST 2013 | dyoungquist
In response to hegemon... This is not a recommended practice but..... We have added a few drops of water soluble flux to our water soluble solder paste when the paste is on the stencil. This was after the paste had "dried" out a bit. We have had
Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup
We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors
Electronics Forum | Fri Jul 29 08:22:34 EDT 2011 | mskler
What will be the specifications of solder paste printing for 6 mil thikness in SnPbAg process. Also what will be the control limits fro X bar R chart. Thanks in advance for the help
Electronics Forum | Fri Apr 27 11:24:53 EDT 2007 | realchunks
Hi Steve-O, Good question(s). This process was set-up by an engineer that had a PhD in statistics, took him a year to develop and then thru it over the wall at us. The biggest problem we saw was SPC to measure solder volume. SPC is good for measu
Electronics Forum | Mon Aug 10 22:18:02 EDT 1998 | Steve Gregory
I am trying to get an idea of what system seems to work best for >solder paste inspection. I am looking for basic table top >models with he capabilites of height and width measurements. >Can anyone give me suggestions, pricing and why you prefer on
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
