Used SMT Equipment | Conveyors
2007 Nutek Wave Solder Entrance Conveyor 220VAC Single Phase Power, L to R Board Flow, Speed control, Adjustable Height and Angle, Edge Hold Stainless Steel Pin Chain with Hold Down Guides, 16" Max Board Width, available as powered up and tested
Used SMT Equipment | Screen Printers
Speedline Technologies MPM UP1500 Solder Paste Screen Printer 10/31/2001, 230VAC Accupro 8.6.3 L to R Board flow, SMEMA, Light Tower, Edge Clamp Board Foils, 29x29 stencil size, Under Stencil Cleaner, Single stage conveyor, Solder Paste Dispense,
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
Used SMT Equipment | Soldering - Wave
Electrovert VectraElite Pb Free Wave Soldering Machine * 480VAC 3 phase power and dry shop air required for operation. * DOM - 09/2007 * Windows O/S * Electrovert ServoJet spray fluxer * Conveyor L to R process flow, rigid intermix V and L finge
Used SMT Equipment | Soldering - Wave
Electrovert VectraElite Pb Free Wave Soldering Machine * 480VAC 3 phase power and dry shop air required for operation. * DOM - 09/2007 * Windows O/S * Electrovert ServoJet spray fluxer * Conveyor L to R process flow, rigid intermix V and L finge
Industry Directory | Manufacturer
SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
Technical Library | 2008-04-29 15:50:45.0
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies
Technical Library | 2019-03-06 21:26:14.0
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints
Used SMT Equipment | Soldering - Reflow
XPM 730A Reflow Oven, 1999 vintage, Pb-Free capable, R-L, Auto oiler, Complete working condition
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