Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch
Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an
Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Fri Oct 23 20:05:16 EDT 1998 | subhash P.
Hi, Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. thanks, subhash
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman
Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.
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