Electronics Forum | Wed Mar 14 20:39:07 EST 2001 | davef
We are unhappy with the effectiveness of the results of our problem trouble-shooting / corrective action process. It�s not as bad as the classic "Ready, Shoot, Aim!" ... but some things just never seem to get fixed. A partento of the causes of our
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon
| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info
Electronics Forum | Mon Mar 15 23:00:40 EST 1999 | Dave F
| In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | Later on we started to us metal stencils, glued in A polyester screen. even than we had som
Electronics Forum | Tue Mar 16 08:38:59 EST 1999 | George Verboven (Process Engineer)
| | In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | | Later on we started to us metal stencils, glued in A polyester screen. even than we had
Electronics Forum | Fri Aug 28 22:15:33 EDT 1998 | Steve Gregory
Chrys wrote: | Sorry to be so long winded. I was out most of the summer and I missed the forum. I promise my next posting will be shorter. Alright Chrys....(hands on hips and tapping foot), just where the heck were you? Did you bother to tell anybo
Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley
| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati
Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon
| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili
Electronics Forum | Fri Nov 23 05:52:45 EST 2001 | Wolfgang Busko
What Claude is saying may be right. But looking at it a bit different from the view of "senior management" this should be interpreted as depending on the salary the work itself is different and therefore the responsibility is different. It doesn�t na
Electronics Forum | Fri Mar 17 14:53:08 EST 2006 | Board House
Hi Brad, Being that I work for a board house here is my take on this issue. In the past it used to be 1 scrap per palt up to 10% of the total order. scrap is supposed to be sepperated to location and packaged sepertaly. Then it turned into No Scra
