Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2015-04-09 10:31:22.0
NEPCON China 2015 will take place in Hall 1 of Shanghai World Expo Exhibition & Convention Center from 21-23 April. The show will cover the latest products and technologies in the fields of SMT, surface welding, electronic test and measurement, electronics manufacturing automation, ESD, and new materials.
Industry News | 2018-10-18 10:04:27.0
How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality
Industry News | 2012-06-15 17:31:01.0
Everett Charles Technologies (ECT) announces that it now offers a wide variety of high-frequency, controlled-impedance, spring contact probes for broadband measurement applications.
Industry News | 2020-08-11 15:03:44.0
Advanced Assembly today announced the installation of its new selective solder machine, the Juki iCube. This new robust system provides the company with a unique ability to perform selective soldering on through-hole mounted components faster and with more repeatability than before.
Industry News | 2018-09-10 18:47:33.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at The Battery Show, Novi, Michigan, USA and at Bondexpo, Stuttgart, Germany. The Helios dispenser deposits single- (1K) and two-component (2K) materials, such as abrasive thermal interface materials (TIM), silicones, epoxies, and greases. Applications include electronic and PCB assembly that requires potting, sealing, gasketing, and structural adhesives/staking for automotive, avionics, aerospace & military electronics, consumer electronics/telecom, and/or industrial products.
Industry News | 2024-03-18 12:15:42.0
PVA, a global supplier of automated dispensing and coating equipment, participation in the 2024 IPC APEX EXPO, where the company will unveil its revolutionary PathMaster X programming software in Booth 2042 from April 9-11 in Anaheim, CA. This innovative software is meticulously crafted for PVA's Direct Series Delta line, offering advanced capabilities and a fully customizable platform tailored to production requirements.
Industry News | 2009-12-07 18:06:10.0
CyberOptics Limited will demonstrate the most comprehensive inspection platform at Productronica. The exhibition will see them unveil the brand new QX500 AOI system alongside the newly launched SE500 and SE500-X 3-D Solder Paste Inspection Systems and the latest innovation in Flex HR AOI software. Visitors are invited to join Cyberoptics in Hall A2, Stand 417 for the ‘complete’ inspection experience, scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2022-04-28 14:33:02.0
Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
Industry News | 2008-03-20 21:02:07.0
Since it�s introduction to the electronics industry over ten years ago, DEK�s ProFlow� enclosed head printing system has won numerous awards and effectively enabled many advances in materials deposition applications around the globe. Now, as ProFlow moves into its second decade, the technology has been further developed to deliver an expanded process window and even broader capabilities.
