Industry News | 2016-03-14 05:03:19.0
We have written two eBook’s Guide to Pin In Hole Intrusive Reflow Design and Assembly and Package On Package Design and Assembly, both are available to download free of charge
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2010-02-15 19:32:28.0
Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
Industry News | 2012-05-01 19:12:41.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference
Industry News | 2017-09-03 08:06:25.0
Our latest Process Defect Photo Guide entitled “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and x-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts
Industry News | 2011-09-06 15:27:12.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) will highlight its 4000Plus multi-purpose bondtester in Booth F05 within the Singapore Pavillion at NEPCON Vietnam
Industry News | 2017-09-05 16:01:43.0
SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that its latest Process Defect Photo Guide “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2009-03-23 13:24:38.0
MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will showcase SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2011-03-07 14:43:24.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.
