Electronics Forum | Tue May 11 10:43:37 EDT 2004 | Melissa
Has anyone experienced problems lately with excess flux residue left on the board after reflow when using Alpha UP78 OSP paste? We are getting a component failure that the designers are blaming on too much residue. Thanks
Electronics Forum | Sat May 28 02:52:17 EDT 2005 | ajaydoshi
We have AOI photondynamic 7750. Problem 1. it hang very often. 2. During starting of day x axix does not move. we need to move manually & then start otherwise it will not move by machine motor. ajay
Electronics Forum | Wed Dec 14 21:19:36 EST 2005 | davef
Heavens to Murgatroyd, we agree with Russ that "black pad" could be the cause of your solderability problem, but oxidized nickel is an additional explanation. While its often easy for assembler to jump this conclusion, it sounds like you've been bla
Electronics Forum | Mon Mar 27 01:03:25 EST 2006 | meritajs
Thank all, We resolve this problem to swap sub-CPU board But we do not know, how to repaire changed board May be somebody could advice something Best regards Peter
Electronics Forum | Mon Dec 11 08:52:11 EST 2006 | beta
Hi, I checked out your component.They are differnet dimensions. You say you are not using the recommended overprint ? if this is the case, I would imagine that is your problem. If you want to contact me off line to discuss further plesae feel free.
Electronics Forum | Sat Jan 06 02:12:36 EST 2007 | backbenchers
i have 1 customer using our reflow oven, he is facing the problem that after taking the boards from reflow oven ICs & some resistors felt down.they are using our glue dispenser also, the glue is not fixed with the component. wht will be the solution
Electronics Forum | Wed Feb 28 14:01:15 EST 2007 | john_smith
Chris, Is there a job scheduled down to the machine? If you don't have it you can call Siemens hotline @1-888-smt-help. They will talk you through any problems that you encounter. John
Electronics Forum | Wed May 16 12:29:57 EDT 2007 | realchunks
Hi Pete, I am familiar with their CM series machine. They have anti static bars inside the machine. If I were you I would measure the board after this machine to see if it retains any ESD. If not I don't think you have a problem.
Electronics Forum | Thu Nov 01 22:32:57 EDT 2007 | lvzhu
CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.
Electronics Forum | Sat Jul 26 11:17:31 EDT 2008 | manishc
i am facing problem of pcb track lifing at B.G.A. after reflow.we r using lead free paste and fr-4 grade pcb with peak temp.about 270 deg.
