Electronics Forum: profiles tombstoning (Page 9 of 17)

Oven profiles. Linear vs. Saddle?

Electronics Forum | Wed Oct 01 20:09:24 EDT 2014 | isd_jwendell

No one has mentioned paste, but I have tested pastes where some do much better than others at not tombstoning parts.

Tombstones? Pb vs Pb Free

Electronics Forum | Tue May 09 17:56:36 EDT 2006 | russ

When we first started we had this problem, we eliminated by longer profile (less delta T) and then ultimately chnaged pad dimensioning for 0402 away from IPC standard. i would highly recommend that you check your placement accuracy and your prof

Oven profiles. Linear vs. Saddle?

Electronics Forum | Fri Oct 03 10:23:29 EDT 2014 | emeto

1. Pad design. Most of the tombstones are result of wrong pad(land) design. One pad is significantly bigger than the other or the metal laying under one side of the part is much more than under the other side. 2. Part placement - should be in the ce

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper

Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and

Re: Tombstone

Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh

I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper

Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and

Tombstoning 0306's

Electronics Forum | Fri Sep 09 11:24:31 EDT 2005 | stepheniii

Talk to your paste supplier. The reps for a couple of pastes have been very helpfull on various problems. And I've seen pastes advertised as being good for reducing tombstoning. And they see lots of customers and therefore see lots of problems and

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics

The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 14:27:00 EDT 2017 | emeto

Here is some food for thought. Try to answer these questions yourself and I am sure you will see huge improvement. Reasons: - Bad PCB design - Plating-uneven HASL cause more than OSP Au/Ni or Silver - Poor paste and print quality - uneven paste ca

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave

| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is


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