Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton
Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29
Electronics Forum | Mon Dec 21 10:20:47 EST 2009 | zanolli
We are looking to purchase a table top batch oven, with nitrogen, for prototype work on various PCB assy's - some with BGA's. The intent is to simulate a multi-zone production oven profile - and we kow that an exact simulation is not possible - just
Electronics Forum | Thu Apr 18 23:56:27 EDT 2002 | Abelardo Rodriguez
I'm trying to get a better understanding of the cooking process of pcb's. The use of nitrogen in reflow and wave ovens. Seems to have a wide margin of acceptance as a standard gas to prevent oxidation of metals in the board. Has any one heard or us
Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado
We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar
Electronics Forum | Wed Aug 04 16:30:44 EDT 2010 | dldavis
We are using a Propyl Bromide vapor degreaser solvent. Has anyone heard of this solvent when used near an oven will decompose and cause major corrosion to metals such as in a Reflow oven or a wave solder pot?
Electronics Forum | Thu Jun 26 09:09:27 EDT 2008 | kmeline
The pad size is okay. I have also requested the manufacturer's recommend reflow profile. I have seen some issues with 0402 caps that we run also but for the most part solder paste does okay. I think the cap issues is stencil related. Still trying to
Electronics Forum | Thu Jan 17 20:17:55 EST 2013 | duchoang
We have got lots of voids at ALL LGA. Anyone has ideas to get rid of this issue or just minimize the size of voids ?. With the same paste, same reflow oven, looking good profile, we don't have that problem with BGA. Thanks.
Electronics Forum | Wed Jan 10 09:57:08 EST 2007 | realchunks
Shields can carry a large thermal mass. If you ever tried removing one in repair, you'd find out how hard they can be. Also, they do deflect air flow. So in a convection oven, your air flow will be turbulent, which also will affect your reflow.
Electronics Forum | Mon May 24 19:38:33 EDT 2010 | smt_guy
Has anyone here specially the Gurus heard, used or seen a Reflow Oven with Vacuum? Is the result really good when it comes to reducing Voids? Can you share any info about this oven? thanks and regards...
Electronics Forum | Tue Oct 30 18:43:31 EST 2001 | mparker
My first thought is board warp. This is something you can't see when the board is in a reflow oven. I see it occasionally going through wave solder. You may need a pallet with hold down clamps for reflow. Try putting a bare board in a baking oven at
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