Electronics Forum | Wed Feb 10 12:35:16 EST 2021 | dontfeedphils
Guessing there's no center support in your reflow?
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Mon Jul 16 10:21:29 EDT 2007 | samir
d0mino, Given the fact that the SLIMKic has built in wave detection, you can just make a pallet out of 10mm delmat material, and drill a couple of holes on the pallet for the wave detect T/C's (ports 2 & 3 for left and right). All the wavesurfer is
Electronics Forum | Wed Nov 23 07:08:31 EST 2005 | Al
Hi, I'm working as a process engineeer at a PCB manufacturing plant. I'm a part-time degree stundent, and for my final year project I have to evaluate and implement a selective soldering process. In order to do this, I need to find some good books
Electronics Forum | Fri Aug 13 10:19:35 EDT 1999 | Boca
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman
A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side
Electronics Forum | Mon Jan 12 02:45:53 EST 2009 | sachu_70
Hi Stefano, Although your concept of Wave soldering such devices is possible, I would look at an alternate solution. An easier way would be to Reflow solder all Bottom side SMD components with solder paste, followed by wave soldering for only through
Electronics Forum | Thu Jan 21 09:55:14 EST 2016 | Sam
We are running a project that is 5 years old. We have yet to resolve all of the issues. Out biggest is warping due to the board being .012" thick. We have created a custom pallet (ricocel) and pallet cover (FR4) to sandwich the board but I am afraid
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