Electronics Forum | Thu Oct 01 20:11:31 EDT 1998 | Wayne Bracy
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed May 08 11:07:54 EDT 2002 | Carol Stirling
We have a concern with moisture absorbtion/humidity effects on PWBs specifically used for automated SMT (including BGA). I'm sure there is a IPC spec on this and would appreciate the number - I've searched the IPC web-site -no results. Could you t
Electronics Forum | Tue May 21 17:25:28 EDT 2002 | Carol Stirling
Hi Dave F, Thanks for the reply, the question was Customer driven. Could you clarify your recommendations for heat sealed moisture barrier bags please - does this include Nitrogen vac pack? Our production runs are small, so there is an investigat
Electronics Forum | Mon Jan 06 11:04:39 EST 2003 | slthomas
Bummer. Are you using the EPAC stuff that they recommend, or something else? We used IPA for a while, then changed to a run-of-the-mill stencil cleaning solvent (aliphatic hydrocarbon based, like the EPAC solvent) that's a lot cheaper and does the
Electronics Forum | Tue Sep 14 07:54:05 EDT 2004 | modwyer
Folks, At the moment I bake all BGA that are in unsealed trays, to reduce moisture etc. Is this common practice or are there particular manufacturuers that cause more problems. Also, the tape for BGA tape & reel has a hole in the tape (as is normal
Electronics Forum | Thu Sep 22 06:54:14 EDT 2005 | Rob
Hi Gavin, Depends on what MSD class, but in general for the more sensitive parts if they've been opened & not used within the time limit it's rebake, add dessicant & seal. Our distribution side splits them down into more manageable/production size
Electronics Forum | Sun Jul 12 21:07:07 EDT 2009 | padawanlinuxero
I have a problem we change a product from leaded to lead free, I was not involve in the selection of the new reed switch, but now we are having problems with the hermeticity in the switch,this occurs after is overmould and put to a 6 cycles in the th
Electronics Forum | Wed Aug 26 05:58:17 EDT 2009 | grahamcooper22
Hi, I have no experience of the ZIP TOP bag you refer to but my advice is to follow the guideline of IPC JEDEC 33 for sealing bags containing MSDs....it states' the MBB should be heat sealed'. I cannot imagine that a ZIP will keep the moisture out an
Electronics Forum | Thu Oct 27 15:57:57 EDT 2011 | sjs2303
Dave, I think he means that when the plough on the feeder peels back the tape, it exposes a few extra components that are yet to be picked. As a result when he is finished with the reel there are some components in pockets that are not required but
Electronics Forum | Tue Jun 25 07:48:32 EDT 2013 | bin95
I agree with everyone else here, 3-6 months for blowing dust out of panel a bit excessive, once per year will be fine in most environments. If you find it needs to be more frequent, you need to explorer dust preventative measures. (Check panel seal,
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