Electronics Forum | Thu Nov 29 22:51:18 EST 2018 | jandon
IPC J-STD-001F: 6.2.1 Solder Application: Solder shall (N1D1D3) only be applied to the one side of a PTH except for intrusive soldering. Heat may be simultaneously applied to the both sides of the PTH.
Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Wed Sep 04 12:50:40 EDT 2019 | smrsteve
Thanks for that Steve - I'll try anything at the moment, but that sounds like a reasonable suggestion. I've already replaced a few cables that looked dodgy, and the LEDs on the LED rings, but I've not done a ribbon cable on the head yet. I shall hav
Electronics Forum | Fri Jan 24 01:46:29 EST 2020 | sara_pcb
I am designing a Single Board Transmitter in the S Band 2-4 Ghz. The design contains DCDC converter , LDO, Synthesizer, FPGA, DAC & RF power amplifier. Which is the nest PCB material to choose ?. Shall i go for I-TERA+HR370 hybrid combination to d
Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F
| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic
Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Wed May 16 13:06:33 EDT 2007 | stepheniii
3.3.2.1 Moisture Barrier Bag (MBB) The moisture barrier bag shall meet MIL-PRF-81705, TYPE I requirements for flexibility, ESD protection, mechanical strength, and puncture resistance. The bags shall be heat sealable. The Water Vapor Transmission Rat
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Electronics Forum | Wed Sep 08 18:52:42 EDT 1999 | Scott Cook
| Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I e
Electronics Forum | Thu Mar 09 10:13:40 EST 2000 | Erick Russell
Hi Casey, I accept your BOLD Rework challenge. Considering you did not say what the TEST was. Let's base it on speed, thermal uniformity, and process repeatability. I have sample boards that I will take to APEX with Back to Back BGAs. Does anyone wa
