Electronics Forum: silicon on solder joints (Page 9 of 29)

Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Sun Jun 20 16:45:48 EDT 1999 | Chrys Shea

I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), and

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 15:27:00 EDT 1999 | Tony

| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 12:57:10 EDT 1999 | Earl Moon

| | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something),

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 13:02:59 EDT 1999 | Earl Moon

| | | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something)

gold finish on pcbs

Electronics Forum | Thu Nov 09 23:27:53 EST 2000 | Craig

We are considering using gold plating on our fine pitch pcbs (as oppossed to HASL). We have heard of long term solder reliability problems with joint imbrittlment how bad is this and does it apply for all of the different plating processes the same?

Printing on soldermask

Electronics Forum | Tue May 21 07:46:58 EDT 2024 | tommy_magyar

Michal, Overprinting is the extension of the stencil aperture over the solder mask, to enable a bigger volume of solder paste on the pad, therefore bigger volume of the solder joint after reflow. https://youtu.be/WAIm-6BSaiQ?si=UMp9WSFal3vXFp8F as

BGA Placement on Flex

Electronics Forum | Mon Jan 20 17:41:38 EST 2003 | James Springer; Advanced Technology Manager

Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints?

BGA Placement on Flex

Electronics Forum | Tue Jan 28 18:24:32 EST 2003 | rob_thomas

Hi James, It's been done and tested and at my previous job.The solder joints life expectancy is the same as for PBGA's attached to rigid substrates. If you want more details and process specific details send me an e-mail at the above address. Good l

Non-wettig on chip cap.

Electronics Forum | Fri Dec 07 11:46:28 EST 2001 | Brian W

Before changing solder pastes or jumping through too many hoops, check the melting point of the 100 Sn (pure tin) connection. According to Kester, the melting point of 100Sn solder paste is 232 degrees C. If you do not reach that temperature, you wi

Dewetting on QFP

Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef

Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa


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