Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Tue Aug 09 12:12:57 EDT 2005 | davef
Why are you placing Kapton dots on your board prior to wave soldering? * Prevent solder from touching the hole and the area around it. [If so, why do you need to do this?] * Prevent solder from flowing up through the hole and coating portions of the
Electronics Forum | Mon Oct 02 14:59:42 EDT 2023 | joeljacobo
Thank you!
Electronics Forum | Mon Oct 02 15:01:14 EDT 2023 | joeljacobo
Thank you Dave, I will check it out
Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
Electronics Forum | Wed Feb 01 03:17:10 EST 2017 | rob
Ok, that's small - I think you may need a special semi-conductor printer for this - positional accuracy on a "normal" SMT printer is no more than 20 micrometres from memory. In my semiconductror fab days we were printing with a positional accuracy
Electronics Forum | Wed Sep 29 19:47:44 EDT 2021 | emeto
"For the lead free soldering of electronic assemblies, the inclusion of silver in the alloy results in better wetting compared to non-silver containing alloys and also allows for a broader process window. Silver also improves joint reliab
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Thu Jun 18 10:57:28 EDT 1998 | Mike Moninger
| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,
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