Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis
The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Fri Oct 02 16:49:33 EDT 1998 | Dave F
Benji: I tend to agree with you that assemblers shouldn't wear make-up. I'm unsure what first level assemblers are tho. I've been down that finger cot/glove route ... 1 If someone is going to smear facial or cosmetic oil on a board, they can do
Electronics Forum | Fri Nov 06 08:50:07 EST 2009 | jeffreyj
adlsmt - I do apply paste (Kester EP256) by hand to the boards now with 5 mil thick stainless steel stencils. A few of the parts almost always need rework, though, either because I didn't place them accurately or there's too much paste, or it got sme
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
