Technical Library | 2012-04-05 22:53:10.0
In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob
Technical Library | 2022-10-31 08:43:27.0
Model/Specification: 12*16MM Common Name: Press Cover/GUIDE Suitable Fo: Siemens Feeder Parts Material: Ceramic Wight: 55g Quality: 100% Tested High Light: 12x16 Smt Spare Parts, 00328503, 00322753S04
Technical Library | 2011-12-08 17:46:42.0
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c
Technical Library | 2012-02-23 21:16:28.0
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro
Technical Library | 2010-05-12 16:21:05.0
Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.
Technical Library | 2017-12-27 22:52:43.0
To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process.
Technical Library | 2015-06-30 22:02:41.0
This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate the importance of selecting an appropriate AOI system. This paper will increase the probability that anyone installing an AOI system during the pre-reflow process will obtain a successful gain with short payback period.
Technical Library | 2010-06-17 20:48:04.0
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.
Technical Library | 2017-03-22 20:58:08.0
Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.
Technical Library | 2012-05-31 18:01:31.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such
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