Project Description | Parameters 16 Layer Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Material: SY ST115 Thermal Conductive:1.5W/m.k Back drilling, laser drilling | Application Electronic Power
Parts & Supplies | Circuit Board Assembly Products
1). 80*50mm/1up, Bergquist Thermal Clad aluminium backed 2). LTI-04503,MP-06503,ML-11006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 35μm (1 oz) 5). Black solder mask/no ident 6). CNC rout outli
5 W/mK) No Resin Bleed
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
Printed Electronic Ink, Nano Technology Thermal Conductive & conductive inks, PEC Technology Circuit Process
Industry Directory | Manufacturer / Other
TTi makes standard and custom thermal platforms, Hybrid Benchtop Temperature Chambers which combine the benefits of a small benchtop chamber with a separately controlled thermal platform for speed, uniformity versatility.
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
Thermal Pads Qoolite™ TH Standard Silicone-Base – IMTH70 Series Intermark USA Inc’s Qoolite™ TH, IMTH series, silicone-based thermal pads are popular items for many applications such as cell phones, laptop, routers, network servers etc. IMTH70 se
