Full Site - : sn63 (Page 9 of 24)

Pb soldering to Pb free finishes

Electronics Forum | Thu Oct 01 16:56:40 EDT 2009 | gplume

Does anyone out there have experience soldering with Pb solder (Sn 63 or Sn 62) to SAC 305 coated PCB lands (about 50um) or Sn-Cu plated lands (about 10um). I know soldering Pb free (Sac based soler) to Pb/Sn coated lands is a no-no, but was waonderi

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C

Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil

Trace Elements in Solder

Electronics Forum | Wed Jun 26 11:13:09 EDT 2002 | robbied

Can anyone help? Our Solder bar suppier is discontinuing the Sn63 Pb37 solder that they currently supply us. Another company has offered us a 'direct replacement' which is their own Sn63 Pb37 solder bar. The only problem I have with this is that the

Solder paste change

Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim

Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha

Solder Paste Flux %

Electronics Forum | Mon Jun 13 10:28:29 EDT 2005 | andymackie

I've had a lot of experience with solder spatter. It's usually related to moisture (humidity) uptake by the paste, or outgassing from plating: particularly Au/Ni. Solder spatter from the plating will change from board-vendor to board-vendor. I shoul

Hand Soldering-Mixing Sn63 and L-F Processes

Electronics Forum | Tue Aug 09 06:21:19 EDT 2005 | bwet

Ladies and Gents: There have been several ways discussed in the trade press and in papers re: how to seperate/keep seperate Sn63 and l-f hand soldering tools. Some claim comepletel seperate hand soldering tools are required, while others claim that

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax

I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo

solder paste ingredients and their effects

Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris

What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(

problem in solderability

Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve

we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th

solder paste selection for an oxidized pin?

Electronics Forum | Wed Oct 22 12:13:18 EDT 2008 | brismittr

A no-clean paste with an above average amount of halides should do the trick. Kester EP256HA is a good choice for this application if you are using a leaded alloy (Sn63 or Sn62).


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