Electronics Forum | Tue Aug 02 22:49:55 EDT 2005 | davef
IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Lead-free soldering anomalies Hot Tear / Shrink Hole is one such anomaly. This shrinkage effect appears primarily on wave-soldered joints, but can also
Electronics Forum | Tue Nov 24 05:23:18 EST 2009 | prodivegsr
Hi Davef, Thanks...Saw 1 of your thread that you posted : Thanks for providing... From davef : There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the
Electronics Forum | Tue Mar 01 11:19:47 EST 2011 | jeddmartens
I have no knowledge into PCB designing with surface mount components, all my experience has been with through hole components. I now have to design PCBs using surface mount parts. I have a few questions I was hoping someone could answer. Can a PCB w
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Thu Sep 02 16:06:33 EDT 1999 | Earl Moon
| Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | What I'm really after is anything describing how close a screw/washer/nut combination
Electronics Forum | Thu Sep 02 16:37:23 EDT 1999 | R Scheller
| | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | What I'm really after is anything describing how close a screw/washer/nut combin
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