Industry News: solder problem (Page 9 of 55)

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

AVX Expands USB Series Transient Voltage Suppressors with 0402 Case Size

Industry News | 2003-05-19 09:53:51.0

The USB Series offers problem free solderability characteristics as well as excellent electrical performance

AVX Corporation

SHENMAO Features Solder Preforms at IPC APEX 2016

Industry News | 2016-03-11 00:15:11.0

SHENMAO Solder Preforms offer accurate solder deposition for various soldering processes. Reel packaged Solder Preforms provide opportunity for automation and efficient application to supplement solder when insufficient quantity solder paste is provided by design.

Shenmao Technology Inc.

Transition Automation Debuts Electronic Paste Manager Self-Cleaning Squeegee System

Industry News | 2008-04-07 23:25:00.0

Transition Automation, Inc. is unveiling for the first time the Permalex Paste Manager, a Self-Cleaning Squeegee System based on a microprocessor controlled torque actuators.

Transition Automation, Inc.

Juki Automation Systems Wins a 2008 NPI Award for Its OPASS Technology

Industry News | 2008-04-07 23:18:22.0

MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.

Juki Automation Systems

Juki Automation Systems� OPASS Receives VISION Award First Finalist Recognition

Industry News | 2008-04-08 22:36:16.0

MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.

Juki Automation Systems

Juki Automation Systems Wins 2008 SMT China Vision Award for OPASS

Industry News | 2008-04-08 23:53:03.0

MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.

Juki Automation Systems

Robotic Soldering - How to Benefit

Industry News | 2020-10-02 05:18:56.0

Join our FREE Robotic Soldering Webinar on Thursday 8th October at 2.30pm UK Time https://www.bobwillis.co.uk/how-to-benefit-from-robotic-soldering-processes/

ASKbobwillis.com

Kyzen's Rich Brooks Holds Successful Presentation at SMTA Silicon Valley Chapter Meeting

Industry News | 2010-04-28 20:24:38.0

NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Rich Brooks held a successful presentation at the SMTA Silicon Valley Chapter meeting, which took place on Thursday, April 22, 2010 from 3-5:30 p.m. at EET, Inc. in Reno, NV.

KYZEN Corporation

FAB Notes Recommendations for RoHS-Compliant Lead-Free-Capable PCBs.

Industry News | 2006-05-25 19:52:40.0

Engelmaier Associates, L.C. announces the availability of a multi-client study/white paper titled: "WHITE PAPER REPORT: Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality."

Engelmaier Associates, L.C.


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