Electronics Forum | Thu Apr 05 11:48:25 EDT 2012 | pbarton
Are you running individual point soldering on each component lead, of are you drawing lines with the solder fountain to increase the speed of the process? Could be that if you are drawing lines, coupled with the very low flux levels you say you are
Electronics Forum | Thu Apr 09 21:21:11 EDT 2009 | qualityguy
Hello, another SME is saying the solder resist cure level is suspect. I have had a industry SME make reference to this too. Adjusting the cure of the resist changes the surface energy
Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef
Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Sun Sep 07 17:16:57 EDT 2008 | gregoryyork
OK Pizza it is then, here goes. Dewetting of Ni/Au pads, paste favouring the Tinned component lead hence excess paste wicking on top of the components. Reason is EITHER Nickel migration into the gold due to high levels of Ionics from poor rinse OR mo
Electronics Forum | Wed Apr 08 01:43:49 EDT 1998 | Clint Meech
We currently screen print glue for our bottom side components. We are looking to get the bottom side of one our boards screened with a solder resist (to cover mounting holes, etc, for the wave-soldering process). This would create an uneven surface
Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN
I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Wed Mar 11 18:28:03 EDT 2015 | gregoryyork
Hi its undercured solder resist which leaves a clear waxy/oily residue and can be seen as brown tar/oil in the molten solder wave. This also causes MicroSolder Balling and some snail trails of solder pick up and worst case bridging and peeling resist
Electronics Forum | Wed Jul 25 10:57:08 EDT 2007 | cecil
Our board layout folks are currently designing a PWB using a 132 QFN. The component is .5mm pitch with .35mm square pads. The component manufacturer recommends the following footprint: .4mm square land .3mm square solder resist 1.why do they spec
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