Electronics Forum | Tue Jul 19 10:28:21 EDT 2016 | mrk
What kind of oscillator are you placing (Manufacturer part #)? I do not believe that oscillators fall under the "chip component" category. Even if they did, most all SMT oscillators that I have come into contact with have 1 sided terminations on the
Electronics Forum | Wed Mar 24 15:10:23 EST 2004 | davef
Without a proper picture, I'd reject the parts that you describe based on IPC-A-610, 7.2, which says words to the effect: Defect - Class 1,2,3 - Dirt and particulate matter on assembly, eg, dirt, lint, dross, metallic particles, etc. Absence or pres
Electronics Forum | Tue Feb 28 20:56:12 EST 2006 | davef
Here you go ... PCB FR-4 Inspection Manual 1 Introduction This defines the minimum acceptability requirements. It is not intended for use as a performance specification for the Company or procurement. It is based on the requirements of Acceptabi
Electronics Forum | Thu May 31 10:52:31 EDT 2007 | patrickbruneel
A solder wire classified as L0 under IPC J-STD-004 means that the flux residues can be left on the board safely, and when you select this type of cored wire the intention is not to clean. You just select a solder wire that gives you an acceptable lev
Electronics Forum | Fri Jan 31 13:55:56 EST 2003 | MA/NY DDave
Hi I hope I am on point based on my reading. The outer edges bow spec depends on a gradual deformation that finally builds up to the outer edges. If you mathematically move this deformation back you will have allowable deformation at the point you
Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon
| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over
Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis
The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ
Electronics Forum | Wed Sep 15 07:43:12 EDT 1999 | Earl Moon
| Hi, | | Can someone pls suggest to me the best reflow temperature setting | for a force air convection oven. The details is as follow. | 1) Heller 1700s | 2) 12 zone---6 top and 6 bot | 3) Solder paste --- Qualitek 691 non clean | 4) board size :
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
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