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MIRTEC Receives the 2018 Mexico Technology Award for Its MV-3 OMNI Desktop 3D AOI System

Industry News | 2018-11-16 15:56:00.0

MIRTEC, ‘The Global Leader in Inspection Technology’, announces that the company received the 2018 Mexico Technology Award in the category of Test Equipment for its MV-3 OMNI Desktop 3D AOI Machine. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

MIRTEC Corp

MIRTEC Receives IPC-2591 (CFX) Certification for Its Award-Winning 3D SMT Inspection Systems

Industry News | 2021-05-14 05:35:57.0

MIRTEC announces that it has officially received IPC-2591 (CFX) Certification for its Award-Winning MV-6 OMNI 3D AOI Seriesand MS-11e 3D SPI Series.

MIRTEC Corp

MAPICS and Georgia Tech Lead Groundbreaking Advancements for Electronics Manufacturers

Industry News | 2003-03-19 08:25:45.0

Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry

SMTnet

MIRTEC Presentation

Videos

MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a

MIRTEC Corp

Cadence Announces Aptivia Parallel Characterization Option

Industry News | 2003-06-02 09:14:01.0

Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x

SMTnet

NEMI Premieres Latest Roadmap at APEX 2003

Industry News | 2003-02-06 08:28:24.0

Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2

SMTnet

Introbotics Announces New Board Testing Capability for Merix Corporation

Industry News | 2003-04-01 08:13:08.0

The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.

SMTnet

NEMI Launches DPMO Project

Industry News | 2003-05-02 08:49:07.0

Group to Assemble Data by Package and Technology Type

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet