New Equipment | Tape and Reel Services
All standard pockets in stock means little to no lead time for our customers. Receive your finished reels correctly done and exactly when you want and need them. All applicable EIA taping standards are strictly enforced while in process and 100% fin
Illinois Components, Inc. Tape & Reel and I.C. Programming Services
State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
SemiPack's capabilities range from fully automatic to manual processing; extensive cropping and forming capabilities; active and passive component processing; axial to radial lead forming servicing; and snap-in and stand-off forms. For SMT processi
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
New Equipment | Solder Materials
AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all solderable electronic surfaces. W20 exhibits excellent print characteristics and 8+ hours of stencil life. W20
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Industry News | 2022-10-11 17:13:35.0
ZESTRON is pleased to announce that it will host a webinar titled "Solder Mask and Low Stand-off Component Cleaning" on Tuesday, October 18th, from 11:00 AM to 12:00 PM EDT. This is the eighth installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Jigar Patel, Senior Application Engineer.
Industry News | 2022-10-20 07:00:57.0
ZESTRON is pleased to announce that it will host a webinar titled "Solder Mask and Low Stand-off Component Cleaning" on Tuesday, October 18th, from 11:00 AM to 12:00 PM EDT. This is the eighth installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Jigar Patel, Senior Application Engineer.
Register for the webinar today:https://pages.zestron.com/cleaning-with-ph-neutral-chemistry-background-applications-and-benefits The greater use of lead-free solder paste and the required higher reflow profiles have resulted in more difficult to re
