Electronics Forum | Fri Dec 24 05:12:08 EST 2004 | Patrick Tavernier
Hi ! Thank's for your replies. I'm seeing you're very concerned about this subject. I think RoHS and WEEE arrive too soon. Not technological solution about whiskers and tin pest. RoHS implicates a lot of money for to implemente news process. We must
Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Fri Mar 06 10:50:21 EST 2009 | fountain42
Just my opinion but it look's like your doing a great job. i would try another paste. I'm somewhat lucky that we get to use OA's. If your stuck using the no-cleans they are so tempermental. (The nitrogen is making up for the poor paste) Your de-wetti
Electronics Forum | Fri Feb 26 08:30:10 EST 2010 | davef
Low cost prototyping * TWS Automation Quadra [www.tws-automation.com 39 0585 634758] * Versatronic RV4 [VSMT Solutions Ltd; 6 Dean Way, Aston Clinton, Aylesbury HP22 5GB, Buckinghamshire; 01296 630341 F01296 632144 http://www.vsmt.co.uk; David Clemen
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Mon Feb 18 09:46:42 EST 2019 | cdav1100
We currently run a Yes Tech BX machine using the Yes Vision software on Windows 7. With Windows 7 support running out in January next year, I was curious if anyone had managed to run the Yes Vision software under Windows 10. The obvious answer is to
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
Electronics Forum | Fri Aug 03 15:20:18 EDT 2001 | stmerkt
The press release attached below provides some insight into the direction Tyco is planning to head with the Automation Group. For Immediate Release Tyco Electronics Expands Automation Group; Offers Quad Systems Assembly Equipment Quad Systems
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
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