Electronics Forum: tenting and vias (Page 9 of 22)

Decoupling caps and PCB layout

Electronics Forum | Wed Aug 10 02:38:36 EDT 2016 | zxcvb

I guess I've been somewhat ignorant when it comes to the finer details of pcb layout. Lately I've read a couple of books that try their best to lead me on the straight and narrow. Here is a couple of examples of a recent board of mine, and I have hig

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett

For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that

Soldermask color relating to thickness

Electronics Forum | Fri Nov 22 05:04:07 EST 2019 | SMTA-Matthew

We have some circuit boards where the solder mask seems clear instead of green on top of some of the tented via pads. No gold deposited during the ENiG process and no solder sticks to it but why is it clear and does it have any correlation to the thi

BGA Via Tenting

Electronics Forum | Tue Dec 21 08:03:10 EST 2004 | davef

It's very possible.

BGA Via Tenting

Electronics Forum | Sun Dec 26 21:24:55 EST 2004 | tellinghuisen

Dreamsniper What is the rationale for the double plugging? And why from both sides?

Market share fo Panasonic, Fuji and Aseembleon

Electronics Forum | Thu Dec 07 12:29:57 EST 2006 | fastek

It makes sense if you think about it. Siemens was a dead company ready to fold up their tents back in the 80's and early 90's. To their credit they stuck to their platform...got somewhat lucky and the market sort of came to them as the wave of users

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett

Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 10:38:30 EDT 2007 | pjc

No dome needed. You should check what type probe you have. You can look here and consult with them: http://www.qualmaxamerica.com/qualmax/leeno/semi.asp?string=ICT

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components


tenting and vias searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
best pcb reflow oven

High Resolution Fast Speed Industrial Cameras.
Pillarhouse USA for Selective Soldering Needs

High Precision Fluid Dispensers