Electronics Forum | Fri Aug 28 05:07:59 EDT 2009 | sachu_70
Do you clean the stencil manually or using the automated under-stencil cleaner on your Printer (recommended)? 1. Ensure that stencil wipes are lint-free and soaked sufficiently with solvent before use. 2. If your printer supports automated cleaning
Electronics Forum | Wed Jan 03 08:22:08 EST 2001 | G. English
Hi, all the best to you smt' netters for the forthcoming year. I am looking for a one stop shop for surface mount consumables, in particular, stencil IPA wipes, printer under screen cleaning rolls, gloves, dry wipes, squeegee blade replacements etc
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw
shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf
Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit
Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway
Electronics Forum | Wed Feb 04 06:48:34 EST 2009 | muarty
Has anyone any experience of using completely dry under stencil cleaning. I have recently been sent some information regarding Micro�Wipe� FP cleaning rolls. The claims about their performance are pretty good, but then what are they like in reality?
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Mon Feb 25 09:34:37 EST 2013 | davef
Oded: The coatings that I mention serve different purposes. * Antiadhesions seem to be designed to improve paste release from the stencil * Flux repellents seem to be aimed at reducing the under wipe frequency of stencils. At IPC APEX 2013, DEK and
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Tue Apr 19 16:20:05 EDT 2016 | davef
Don't blame it on the poor paste thickness requirement [although I might go on to argue that it's could be a contributor to the issue]. Most likely you're the problem. About 70% of the time solder on gold fingers is caused by poor cleaning of screen
