Full Site - : v-tek tm 20 (Page 9 of 60)

Mydata TM8C

Mydata TM8C

Used SMT Equipment | Pick and Place/Feeders

 We purchase original factory excess inventory from various companies that have discontinued products that are still currently active in the field. The purpose of our company is to extend the life of your equipment investment at a much lower cost tha

Mike Ozimek

Mydata MY100SX-14

Mydata MY100SX-14

Used SMT Equipment | Pick and Place/Feeders

in a very good condition, yearly maintained (last 01/2020) . Further: Software: TPSys 2.6.5a Transport: TP3 Inclusive Equipment: 3 Agilis AM8 1 TDM Flex 1 TM Flex 2 TM8 Options: Electrical two-pole test Opti

As-equipment

A High Thermal Conductive Solderable Adhesive

Technical Library | 2016-11-17 14:37:41.0

With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.

YINCAE Advanced Materials, LLC.

Vitronics XPM2 Lead Free

Vitronics XPM2 Lead Free

Used SMT Equipment | Soldering - Reflow

Vitronics XPM2-1030 Lead-Free Reflow Oven Multiple Units Available. Factory Closure - www.xlineassets.com SMT Line #1 2006 MPM Speedline Accela Screen Printer 2007 Universal Advantis AC-30 4983A 2007 Universal Advantis AC-30 4983A 2016 Bro

X-Line Asset Management

Adaptsys shows-off ‘Fast Carrier Tape’ service at Motek

Industry News | 2016-10-06 11:36:41.0

Adaptsys today announced its plans for the Motek international trade fair. Motek is the world’s leading event in the fields of production and assembly automation, feed technology and material flow, and industrial handling technology, and runs from 10th -13th October in Stuttgart. Adaptsys can be found on stand 4555, Hall 4.

Adaptsys Group

Defect-Based Test: A Key Enabler for Successful Migration to structural test

Technical Library | 1999-05-06 14:39:20.0

ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.

Intel Corporation

Mydata MY12E and MY15E

Mydata MY12E and MY15E

Used SMT Equipment | Pick and Place/Feeders

Mydata MY12E 2009 Vintage, 2-LCD monitors, 1-MYDATA vision system, 1-HYDRA 2lk ER LVS vision, 1-MYDATA dual vision, 1-Midas mount head Mydata MY15E 2009 Vintage, 2-LCD monitors, 1-MYDATA vision system, 1-HYDRA 2lk ER LVS vision, 1-MYDATA dual v

Cardinal Circuit

Test Equipment Connection

Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer

The Worlds Largest Distributor of New, Refurbished, and Second Hand Electronic Test and Measurement (T&M) Equipment.

Pick and Place machine TM45P

Pick and Place machine TM45P

New Equipment | Prototyping

1.Product Introduction The third generation model TM245P is NeoDen Tech’s independent product,with completely independent intellectual property,leading this technology in China. TM245P series is the third generation of Neoden Tech’s desktop pick an

NeoDen Tech Co.,Ltd.

Small prototypes Pick and Place machine TM245P(Standard)

Small prototypes Pick and Place machine TM245P(Standard)

New Equipment | Pick & Place

1.Product Introduction The third generation model TM245P is NeoDen Tech’s independent product,with completely independent intellectual property,leading this technology in China. TM245P series is the third generation of Neoden Tech’s desktop pick an

NeoDen Tech Co.,Ltd.


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