Electronics Forum | Fri Aug 30 17:39:34 EDT 2002 | slthomas
Can't seem to get a reply through (watch, they'll all show up in about 15 minutes), so I'll try this. Thanks guys. Hi Larry, long time no talk to. "Dispenser Boy"???!! If they wanted me to build them (instead of the overseas CM) I'd print them my
Electronics Forum | Wed Dec 17 08:49:04 EST 2003 | patrickbruneel
Kev, It looks like you have a preheating powerplant and you still only get the board up to 85 Deg. This indicates that the preheating is out of calibration or the range settings might be very wide (Fex the preheat elements shut down at 500 and go ba
Electronics Forum | Thu May 18 16:10:18 EDT 2006 | adlsmt
We did a tin bath on ours but it was provided for free by Nihon Superior so that is a no-brainer. It was better than taking a risk of having to dump the pot. If you cant get a free tin bath, then you should probably go ahead and fill it half way or s
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
Electronics Forum | Tue Dec 16 06:42:51 EST 2003 | Kev
I am having problems achieving correct pre-heater temperatures with our Hollis solder wave. Our original "Verification Golden board" program uses a conveyor speed of 5ft per minute and pre-heat temps of 300, 350, 400 respectively. Our "golden Board"
Electronics Forum | Thu Mar 18 20:08:34 EST 1999 | Steve Gregory
Are you suggesting there may be some chemical incompatibility between paste/flux chemistries and the glue being used - thus intefering with the glue's ability to bond properly? I've only heard of this possibility, but never experienced it. Justin, St
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Mon Feb 28 13:13:25 EST 2005 | russ
ING, you had to nake it difficult didn't ya! It appears that all of your parameters are okay. When you state that "sometimes there is a residue" is it liquidous or dry? Is your spray fluxer an ultrasonic or a spray gun head? You may not be getting
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
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