Electronics Forum | Thu Jun 27 08:41:38 EDT 2013 | emeto
I would suggest that you go to the X-Ray world. I know for sure that Dage(Nordson Company) can make actual u-cut for the ball of the part. They can see and measure everything in 3D. I am sure if they can do it other X-ray machines can probably do it
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
Electronics Forum | Tue Dec 27 13:58:20 EST 2005 | samir
I think alot of those X-Ray machines out there "over-emphasize" BGA analysis. It'll measure every aspect of the BGA, like size of voids, percent voids, how many voids, cumulative sum of the voids, shape and geometry of voids, statistical distributio
Electronics Forum | Sun Feb 09 23:41:37 EST 2003 | Dreamer
What are the key features that I need to know when evaluating an X-Ray Inspection Machine? Thanks for your feedback
Electronics Forum | Mon Oct 25 12:57:58 EDT 2021 | lewis_and_clark
Have you look at any Glenbrook Xrays or older VJ Eletronix? They should be in your budget range and you can find plenty of data regarding their abilities with a quick google search.
Electronics Forum | Tue Aug 11 12:15:34 EDT 1998 | X-man
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai Stoney, Probably the best rewor
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Thu Apr 27 21:04:33 EDT 2000 | Dave F
Ron: Good news: Nicolet makes excellent machines. Bad news: I�m unaware of a machine with the capabilities you seek. * X-ray machines lack of resolution needed in relation to the crack geometries encountered within a high density single material.
Electronics Forum | Thu Sep 16 14:57:22 EDT 2004 | russ
We have this machine and I would be surprised if it really took all two hours for training. The machine is very easy to operate. I don't believe that Glenbrook provides "inspection" training if that is what you were thinking. We love it and it do
