Electronics Forum | Wed Apr 22 05:33:06 EDT 2015 | mbb
We'have been working on an issue regarding aluminium capacitor placement in PCB. In fact, we have twisted (shifted) capacitors. Through root causes analysis, we confirmed that this phenomenon is happening during reflow process (no issue on placement
Electronics Forum | Fri Feb 21 07:14:59 EST 2020 | bk
I would always have top and bottom preheaters in a solderwave machine. Even if you can make it work without them, it's better to heat both sides of a board then just one. Far less stress on the parts you are soldering. Plus you may need it one day fo
Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau
Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Tue Aug 18 10:11:04 EDT 2009 | grantp
Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process
Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC
Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St
Electronics Forum | Wed Dec 15 04:59:40 EST 1999 | Joshua Hall
Hello KA, When producing in kind of PCB product you have to base much of your decision on cost effectiveness, time, and quality. In order to get the best of all three you have to decide which you want to be your top priority. By adding an epoxy to
Electronics Forum | Thu Aug 29 20:01:23 EDT 2002 | davef
Many people use the same spacing [and pad designs] as they use for primary side SMT. We don�t. DOWN STREAM SMT-TO-SMT SPACING: In addition to proper orientation, components cannot be immediately upstream of terminations that are to be soldered or b
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
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