Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn
It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture
Electronics Forum | Tue Jul 14 10:23:42 EDT 1998 | justin medernach
| Hi all, | We are currently having problems with a laser-cut stencil that is | electropolished and nickel plated with 9-mil openings. The paste does | not release well from the apertures. We are having to wipe after every | print. The board is fixtu
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland
I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th
Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby
Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol
Electronics Forum | Mon Dec 04 14:27:18 EST 2006 | pjc
Solder preforms can be used in SMT assembly for through-hole pin-in-paste process. In this process and modified aperture is used to print the paste with standard stencil printing, then a solder preform is picked and placed by a machine into the solde
Electronics Forum | Mon Aug 23 10:11:55 EDT 2010 | flipit
Hi, I have never been able to find an acceptable dispense process for dispensing small dots of solder paste. I currently have an auger screw automated dispense system and can not accomplish 0.010" dot sizes. In addition, stencil printing is much m
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Thu Apr 19 11:04:43 EDT 2001 | Spanky
All, We are getting ready to start running with 0201 passives. I have never run these before. We have run some 0402s however. We don't have any assemblies in-house yet, so I can't give any intelligent information regarding the board design (size,
