Electronics Forum: smt (Page 835 of 925)

Re: Is baking PCB necessary before solder process?

Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F

| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into

Re: Is baking PCB necessary before solder process?

Electronics Forum | Thu Jul 29 00:23:45 EDT 1999 | ScottM

| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into

Re: Is baking PCB necessary before solder process?

Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko

| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into

Re: Micro-BGA soldering

Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon

| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F

Re: Competitors in Semi-Automatic Printer market?

Electronics Forum | Wed Jul 28 19:27:57 EDT 1999 | Ed R

| Just out of curiosity, who's holding the market for the semi-automatic screen printers these days aside from Transition Automation? I know MPM offers some printers in that price range, but are they holding any real market share in that niche? | |

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 12:49:47 EDT 1999 | Tony

| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

Re: NEPCON West vs APEX Show

Electronics Forum | Wed Jul 21 19:59:42 EDT 1999 | Deon Nungaray

| I am curious as to what everyone is thinking about having both the Nepcon and Apex showsn next spring? Will people be attending Nepco, Apex, both or are we seeing the industry tradeshows saturating us? We are trying to evaluate these as an exhibit

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 17:53:34 EDT 1999 | Boca

| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Re: Sub-contractor selection

Electronics Forum | Wed Jul 07 15:30:18 EDT 1999 | JohnW

| | We are looking for some subcontractors to do surface mount | | technology boards for us. Is there anything I should pay specific | | attention when I visit the subcontractor's site? | | Thank you for any advice | | | Carol, | | Someone bel

Re: Water Batch Cleaners

Electronics Forum | Sun Jun 27 12:24:43 EDT 1999 | Scott Cook

| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components


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