Electronics Forum: board (Page 843 of 1642)

Testronics 504 AOI

Electronics Forum | Thu Oct 15 19:00:58 EDT 2009 | ericg2000

I started a new company that has a Testronics 504 AOI machine. No one knows how to program it, and they can't find the manual. So far I have been able to load a centroid file, and set the board size. However, when i load everything, all my parts a

Researching placement machines - where do I start?!

Electronics Forum | Fri Oct 30 10:21:25 EDT 2009 | gantry228

I know of a machine that has: - 54 8mm slots - Single up JEDEC tray holder - And the availability to present tube parts without taking feeder slots. This product has full vision and can pick and place 0201 components and "fine" pitch to .020". With

AOI for solder inspection

Electronics Forum | Thu Oct 29 21:16:15 EDT 2009 | mah115

Fellows, We are considering getting an AOI machine to inspect boards that our vendors are giving us (we outsource the assembly of PCBAs). We have low volumes of boards, but every time a defect does slip by our human inspectors, it causes a lot of

Assembleon / Philips support. Ask your question.

Electronics Forum | Sun Feb 28 12:40:47 EST 2010 | jmelson

I'm in St. Louis, MO, US Midwest. I wrote my own CAm interface, and it works REALLY well. It is only about 2 pages of c code. Of course, it only translates from one CAD package's format to one P&P machine's format. That makes it much simpler to w

Strange things ocuring during reflow...

Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t

Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs

PCB Surface Question - Picture attached

Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef

You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam

Quad 4C place problem

Electronics Forum | Wed Mar 31 06:08:45 EDT 2010 | miroyu

Hi everyone ! I started to program quad 4C for the first time and have some problems. First, board detection LED and proximity Led (on the front panel) are not lightning whatever I do! Second problem is I teach machine board size, nozzle locations

YesTech YTV-2000 Question

Electronics Forum | Mon Apr 05 09:33:42 EDT 2010 | flanz

Hello. I'm new to the group and would like to ask a question about a YTV-2000 that I have. Question is - Could someone explain why my Yestech 2000 has a hardtime with calibration? What happens is that I run calibration before I start a new board.

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Sat Apr 24 10:43:31 EDT 2010 | davef

Hege: Sounds like this customer is a putz. Ask the putz to sign a release, acknowledging responsibility. Here's a couple more links on imm silver: * http://www.pcbdesignschool.com/wp-content/uploads/2009/08/the-study-measurement-and-prevention-of-t


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