Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020
Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more
Electronics Forum | Wed Sep 05 14:51:47 EDT 2001 | gdstanton
Well, it appears after running both a bare and populated PWB we were seeing flux exhaustion on the uBGA. The problem apparently resulted by a recent maintenance effort where the air blowers in the reflow oven were replaced. The blower replacement m
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1
apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo
Electronics Forum | Thu Dec 11 08:22:26 EST 2014 | emeto
The longer the oven, the better. You will have much more capabilities in creating the precise profiles the way you want them(with10-12 zone oven). I have worked with ovens from 2 to 12 zones and the difference is huge. In my opinion try to get a 10zo
Electronics Forum | Thu Nov 10 14:42:59 EST 2005 | SuMoTe
I need a new set of gloves for my operators at the end of the reflow oven. MUST be ESD safe. What do you use/recomend?
Electronics Forum | Wed Dec 10 16:14:37 EST 2014 | jimpat
The 300 degrees is the temperature as measured at the sensor. The actual air temperature just above your PCB may actually be much less. If the oven is properly calibrated then the 300 should represent air temperature at the board but I have seen ma
Electronics Forum | Tue Dec 23 10:31:46 EST 2014 | jimpat
Sounds like your volumes are pretty low. Pick and Place is the bottleneck in the assembly line. Consider an oven that can keep up with the throughput of your P&P. "The best" is determined on individual cases for a specific application and enviro
Electronics Forum | Wed Dec 10 16:58:53 EST 2014 | sreejhu
Hello, yes you are absolutely correct. I agree with your point. Last week,I personally checked out my board on Heller 1088 which is a 8 zone reflow oven (4 on top and 4 on bottom) and the soldering came pretty nice. So comparing with that situation
Electronics Forum | Fri Aug 30 22:14:58 EDT 2013 | isd_jwendell
I have used the 850's previous version (and other batch ovens). The current specified was AFTER the unit was at operating temperature, not what it took to warm up. If you have power restrictions, like I do, be careful with this model. Having used ba
