Electronics Forum | Mon Sep 19 09:02:10 EDT 2005 | clampron
Good Morning Everyone, We have a customer that produces RF based assemblies. We are building several board types for them, all of which have an "RF" area of the PCB. This RF area does not have any mask to define pads. There are also several issues w
Electronics Forum | Thu Nov 10 21:15:39 EST 2005 | davef
Years ago, there was discussion of making a "IPC-A-640" to define requirements for assemblies comprised of more than a circuit board assembly. We don't know what happened after that. As an alternative consider: Telcordia GR-78 - Generic Requiremen
Electronics Forum | Tue Dec 06 14:30:49 EST 2005 | Samir Nagaheenanajar
I agree with Ken!! Amen to that, brother! At my company here in Rihad, our design guys are in a tizzy about lead free components and tin whiskers, and with every questionable through-hole solder joint, or when our purchasing department gets "notif
Electronics Forum | Fri Dec 30 11:54:53 EST 2005 | John S.
Seen cap cracking before. It can be caused by thermal stress as noted above, but don't discount mechanical stress and handling. Your depanelization method is a strong candidate. We applied strain gages to baords and benchmarked various mechanical
Electronics Forum | Thu Jan 12 01:07:34 EST 2006 | pavel_murtishev
Good morning Mark, CAM (Computer Aided Manufacturing) products are designed to solve such tasks. You can try CAM350 for example. CAM350 understands different ASCII exported data from different CAD systems. CAD ASCII export contains all necessary inf
Electronics Forum | Wed Jan 18 08:34:09 EST 2006 | Nathan
We are designing a new in-line inpsection station for PCBAs and I am a little confused about how to interpret two the Mech. Interface standards in SMEMA 1.2 (items 5 and 6). What is exactly meant by "maximum gap"? Does this get at the distance betw
Electronics Forum | Mon Mar 13 18:06:35 EST 2006 | slthomas
So, if 45� is theoretically optimal for aperture fill, but 60� is better for defining fine pitch bricks, is 52.5� the best compromise for an all around design, or does it not work that way? I see blades with either one angle or the other but with th
Electronics Forum | Wed Apr 19 03:10:30 EDT 2006 | Slaine
I solder a lot of differnt products throught a Reflow oven that are non PCB baised Axial leaded components typicaly, mounted vertically in jigs. where i can for cost reasons I use aluminium jigs but you have to experiment with the thermal mass and de
Electronics Forum | Thu Jun 22 18:43:08 EDT 2006 | Bolos
guys, anyone who can comment on this..we have a new project to design ..either to choose BGA vs. QFP and since we all know that BGA is preferable. I preferred as well BGA but my expert designer need extra 3 dollars on the board ?/ HOW TO WIN??? I h
Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com
I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli
