Electronics Forum | Tue Sep 16 13:43:48 EDT 2014 | gascon5383
We have new stencils produced every 15000 prints. Another technician takes care of that and he uses gerber files to have them produced. Also, we have over 300 different products that are produced, all board sizes are standardized 287mm long x either
Electronics Forum | Mon Nov 10 09:03:47 EST 2014 | rgduval
I can't claim to be an expert....I've just bought a used RPS, and it'll be my first...but, after reading through their manual, and working on setting things up, I'd say: -Conceptually, I like the idea of moving the board rather than moving the entir
Electronics Forum | Wed Nov 19 18:43:04 EST 2014 | gregcr
Hi All, I've been in the CM world for a long time and it seems like there has been little change in the packaging techniques used at the end of the day. Assembled circuit boards in small/flex volume are bagged or bubble wrapped and boxed up to ship
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Tue Dec 23 10:31:46 EST 2014 | jimpat
Sounds like your volumes are pretty low. Pick and Place is the bottleneck in the assembly line. Consider an oven that can keep up with the throughput of your P&P. "The best" is determined on individual cases for a specific application and enviro
Electronics Forum | Fri Jan 16 16:34:01 EST 2015 | rgduval
It's a four-spindle head. I've already learned the joys of the size of the nozzles...on a job that had an 0603 cap a bit too close to an SOIC. The first panel ran, and the cap placed after the IC...and I had parts everywhere. Got it figured out an
Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
Electronics Forum | Sun Mar 01 04:24:06 EST 2015 | 3dpcb
Thanks Sarason, You are right that chemists and physicists now have some new tricks. Using nano-chemistry the physical properties of the materials change. The melting temperature of our nano-particle silver is below 150C. The insulator is also a nano
Electronics Forum | Wed Apr 01 10:52:59 EDT 2015 | superlen
Oh, I forgot to add a sample of what my export looks like. Note: that I don't have anything in the VERSION block & I wonder if this might be a problem. [VERSION] [PCB] Unit System = MILIMETER Coordinate = LOWER RIGHT Rotation = 0 Placement Ori
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
