Electronics Forum: good (Page 850 of 1214)

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien

| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Need a UV resistant black potting material

Electronics Forum | Fri May 28 12:51:11 EDT 1999 | John Thorup

| Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to

Re: SOT23 crack during solder reflow

Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup

| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component

Re: Baking PWB's

Electronics Forum | Mon May 24 10:45:04 EDT 1999 | John Thorup

| Can anyone help me with the correct baking cycle for removing moisture for PWB's. These are 10 layer double sided SMT. | | Thank You R. J. Klein Wassink in Soldering in Electronics states - 16 hours @ 105C or 40 hours @ 80C in a ventilated oven

Re: About PCB assembly process

Electronics Forum | Thu May 20 10:45:43 EDT 1999 | Nancy V

| Hi everyone. My name is Martin Benites from LIma, Peru. I am actually working on a project for automate PCB assembly process in our industry. Actual process is hand-based, thus our startpoint is zero equipment. | I have already asked some companie

Re: About PCB assembly process

Electronics Forum | Thu May 20 10:46:53 EDT 1999 | Nancy V

| | Hi everyone. My name is Martin Benites from LIma, Peru. I am actually working on a project for automate PCB assembly process in our industry. Actual process is hand-based, thus our startpoint is zero equipment. | | I have already asked some comp

Re: Reflow Oven Atmosphere Purity

Electronics Forum | Wed May 12 20:43:53 EDT 1999 | Earl Moon

| Folks, | I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? | It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. | What

Hand-Solder Pre-Heat

Electronics Forum | Fri Apr 30 10:34:16 EDT 1999 | Ryan Jennens

Mornin! We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be advantag

Re: Successful Transfers to Contract Manufacturers

Electronics Forum | Wed Apr 28 14:32:36 EDT 1999 | JohnW

| | | Thank for the input. But I guess I was looking for more. We have been transferring boards for some time and a have good working relationship with our primary CEM and have worked out many bugs. I was thinking more on the order and don't shoot


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