Electronics Forum | Sun Dec 22 04:47:26 EST 2002 | eduardo martinez
Hi to everybody. I have some questions. I have a component whit the next description: res. fmf .100 3010 1 S physically, the component have wrote: 22R1. My questions are: what it means? is it a presition resistance? what is the value? Thanks a lo
Electronics Forum | Fri Apr 25 08:48:25 EDT 2003 | davef
If what you say is accurate, two thing come to mind: * Pads on the board are incorrect for the tombstoning components. * Profile is different on the individual pads of tombstoning components. We have heard of, but never seen, components [tants] that
Electronics Forum | Wed Oct 15 16:15:24 EDT 2003 | russ
A good pad design along with a capable placement machine should handle this easily. 16mil pitch components need placement accuracy to about .002" so this shouldn't be a big problem to achieve. This placement tolerance is also basically the same as
Electronics Forum | Thu Apr 22 21:34:58 EDT 2004 | adam
Thanks guys. I am from a subcon, we can't change the solder paste supplier and there is only one approved vendor for this component. I think I will try on the component solderability. Regards
Electronics Forum | Thu Jul 22 15:35:43 EDT 2004 | C.W
have you searched thru the component spec.? the component manufacturer should have the foot print guide line.
Electronics Forum | Thu Sep 02 09:29:25 EDT 2004 | frankracine
Hi laxman, Only to answer one of your question, actually almost 50% of component we use switch to lead free alloys. We receive confirmation for transition to lead free of at least 10 components per day. So, Yes I think all component will be ready
Electronics Forum | Fri Jan 14 21:44:52 EST 2005 | Chua
Hi, I have component like QFP and connector which is lead free component. And now the process still is leaded process. Pls advise whether I can use the lead free QFP and connector on leaded process. Appreciate the help.....
Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs
have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.
Electronics Forum | Thu Feb 17 08:14:57 EST 2005 | davef
The issue may not be the solderability protection. It could be that the metalization on the component terminal or the metal of the component terminal was not prepared properly before the solderability protection was added.
Electronics Forum | Wed Mar 30 08:06:17 EST 2005 | davef
Considerations are: * If the nonwetting is component lot specific, the could be solderability issues with that lot. * If the nonwetting is is a broader based component issue, the solderability protection on the component may require a different reflo
