Electronics Forum | Mon Apr 06 13:59:18 EDT 2009 | wbrenner
For your responce on OrbelE-Z SHIELD. Are you referenceing the PCB pad is 1 to 1 with the fence foot print? Thanks
Electronics Forum | Thu Apr 09 07:37:18 EDT 2009 | fowlerchang
Another suggestion for it. Baking the whole boards before rework the BGA. It is not only benifit to the BGA but also to the pad.
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Tue May 19 03:19:33 EDT 2009 | cunningham
Has anyone used a hot press to bond new pads to the boards if they have been lifted? we have one and have tried and carried out some DOE's on FR4 boards but when trying the same settings on Polyamide they basically fell of can anyone give any pointe
Electronics Forum | Wed Jul 01 07:51:29 EDT 2009 | wrongway
Hello All We are going to run our frist 0402 parts soon. do I need to go to .005 stencil or will .006 work ? do I need to use a type 4 paste ? pad design does a standard rectangle work or the round pads ? Thanks in advance for any replies.
Electronics Forum | Tue Aug 25 13:30:35 EDT 2009 | rossi
It appears that the crack is between the paste and the ball. We physically pulled off the BGA by force and almost all the balls broke at the PCB. There was a thin layer of solder left on the pad. Maybe 1% of the balls stuck to the pad. I have attac
Electronics Forum | Mon Aug 24 21:43:28 EDT 2009 | davef
In reworking 0201, we: * Cut the 0201 in half with a side cutter * Heat the solder on each pad separately and flick the half 0201 off the board * Preheat a new component to +150°C with a hot plate * Solder a new 0201 on the undressed pads with a hot
Electronics Forum | Fri Aug 28 14:00:21 EDT 2009 | kennyg
O.M.G. ! Its blue pad ! ...RE: O.M.G. ! Its blue pad !... or blue balls, assuming there are BGA's on the assembly
Electronics Forum | Fri Oct 23 17:40:19 EDT 2009 | gregoryyork
So if you have Carbon showing on this would this not mean it is something Organic contaminating the pad.I have seen this before with solder resist depositing over the pad.
Electronics Forum | Wed Nov 04 07:53:56 EST 2009 | tstrat
The phosphorous concentration was not elevated w.r.t. levels needed for black pad syndrome. It is not via-in-pad. The component on the board that has been failing is just a standard BGA.
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