Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Mon May 04 21:54:14 EDT 1998 | Dave F
| I've never seen this before. Today, I got this tombstoning on Tantalum Capacitors (Okay, I saw that before) | Here's the part that seems weird to me: | -They didn't tombstone onto a termination - they went onto their sides! That's right, both ter
Electronics Forum | Fri May 01 22:05:23 EDT 1998 | D.Lange
| I've never seen this before. Today, I got this tombstoning on Tantalum Capacitors (Okay, I saw that before) | Here's the part that seems weird to me: | -They didn't tombstone onto a termination - they went onto their sides! That's right, both ter
Electronics Forum | Fri May 01 14:44:26 EDT 1998 | Earl Moon
| I've never seen this before. Today, I got this tombstoning on Tantalum Capacitors (Okay, I saw that before) | Here's the part that seems weird to me: | -They didn't tombstone onto a termination - they went onto their sides! That's right, both ter
Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Tue Apr 09 15:23:05 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:10 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen
Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem
Electronics Forum | Thu Apr 03 11:57:38 EST 2003 | davef
R4: We see the ball left on the PCB with a flat top and the BGA pad appears to be virgin. D4: Not good. The flat top indicates that the ball melted at one time or another. This pad and ball have seen at least two solder cycles with solder and flux. S
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