Electronics Forum: caring (Page 87 of 127)

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 17:51:45 EST 1999 | gcollier

| | Hi everybody. | | Somebody know any consideration or special care to make a profile for BGA's. | | | | any advice is aprecied. | | | | thanks | | Al Carrillo | | | | | Hi Al, | A BGA should be looked at just like any other surface mount d

Re: N2 Reduction

Electronics Forum | Tue Dec 29 12:57:08 EST 1998 | Earl Moon

| Does anyone have angles on how to reduce N2 consumption at reflow process (i.e. process control equipment, etc.)? | | Any help would be appreciated | N2 consumption is very "machine" and process dependent. Some machine designs are better equipped

Re: Batch Cleaners

Electronics Forum | Wed Dec 09 19:21:13 EST 1998 | Bill Schreiber

Dave, Be careful if you plan to clean misprinted PCBs in a spray type batch cleaner. There is an article written by Dick Clouthier of AMTX Stencils regarding batch cleaners and their use for cleaning misprints. He describes it as a "solder ball nig

Re: PCB preservation.

Electronics Forum | Thu Nov 19 11:06:40 EST 1998 | Earl Moon

| We have some PCB�s in our warehouse in Manaus - Brazil. They are stored for more than 2 years , in a condition of 25 degrees centigrades and a humidity ranging from 60% to 90%. | Do these conditions cause the PCB�s to deteriorate over time? If so ,

Re: Spray fluxer vs.Foam fluxer

Electronics Forum | Tue Nov 10 09:27:04 EST 1998 | Chrys

| | | I need to find out the benefits about having a spray fluxer.Right now we are using a foam fluxer on our electrovert wavesolder. We are thinking about investing in a spray fluxer and I want to know if anyone has used a spray fluxer and if any pr

Re: Equipment Selection - Maintenance History

Electronics Forum | Wed Oct 28 16:54:17 EST 1998 | Dave F

| Sirs, | | what would be a good way to judge the reliability/robustness of a stencil printer or chip shooter? | | Does any equipment supplier specify detailed maintenance schedules? Is there a source of machine failure data (MTBF, etc.)?

Re: Cleaning No-Clean

Electronics Forum | Sat Oct 17 10:50:11 EDT 1998 | mike

| | | All Y'll | | | | | | How do you clean components that must be added to an assembled board after water wash? | | | | | | BACKGROUND | | | | | | Our basic process goes like this: | | | | | | 1 Print paste with OA flux, place, reflow, wash |

Re: Double-sided reflow process.

Electronics Forum | Sat Oct 10 04:58:18 EDT 1998 | Tony B

| *Reply to: ericr@nj.tanon.com | | Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/

Re: SOLDER BALL UNDER THE PCB AFTER REFLOW SOLDERING

Electronics Forum | Thu Oct 01 19:07:48 EDT 1998 | Paul R. Smith

Kyung Sam, Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or you

Re: Prove no-clean is clean

Electronics Forum | Thu Sep 17 12:08:13 EDT 1998 | Graham Naisbitt

Wayne, I think Dave and Justin are correct but I would just add my twopennworth: Your customer presumably wants to know if the end-product will be reliable? If he/she wants you to prove cleanliness, ask them for the spec they want to work to and app


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