Electronics Forum | Thu Oct 09 13:27:47 EDT 2003 | MA/NY DDave
Hi Haverhill DavidF, SMTA, SMTnet, I should know this, since Dave does raise a good point that involves the Charge Coupled Model for how ESD creates an event. Be careful you don't blow those components as you seek to create higher and higher vacuum
Electronics Forum | Fri Sep 26 08:28:24 EDT 2003 | successmani
Thank you Russ for the information. One more clarification- I found that the %metal content in lead free paste is in the range of 88-89.5 whereas %metal content in Sn-Pb paste was 90% in general. What is the reason behind this reduction of %metal co
Electronics Forum | Mon Sep 29 02:35:28 EDT 2003 | Sam
Hi Mantis. Has there been any changes in the BGA itself? One of our BGAs changed to a newer type, and after that we had problems with corner lifting. In that case problem was BGA's structure, there was mismatch in TCE between BGA's substrate and mo
Electronics Forum | Wed Oct 01 15:45:35 EDT 2003 | Jalinous Esfandayri
Hi Everyone: Does anyone know what the right silicone for bonding the pressure sensor bare die on PCB is? How do I prevent the fracture and keep good adhesive? Any help would greatly be appreciated. Regards, Jalinous Esfandyari Intelligent
Electronics Forum | Wed Oct 01 21:22:37 EDT 2003 | ramanandkini
We have a 1.6 mm thick automotive PCB board of size 35x70mm. One of our vendor has given us a batch with lesser soldermask thickness 5~8 microns. Will this affect the circuit board on a long term. What should be standard for the soldermask thickness?
Electronics Forum | Thu Oct 02 11:08:45 EDT 2003 | russ
We verify each reels P/N prior to placing into the machine for any reason. I have been bit even harder than John. We built 80 boards with 672 per 0402s when we discontinued the two operator process. We now even have them read the numbers backwards
Electronics Forum | Wed Oct 22 17:26:59 EDT 2003 | Terry Munson
Yes Ion Chromatography can when using a isolated extraction system called the C3 tester. Please email me or call of-line and we can show you what we have done for others to not only idendity the flux cleanliness levels but to qualify the cleaning pr
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Electronics Forum | Tue Oct 14 23:30:38 EDT 2003 | Dean
Get high magnifiction micro structure analysis of the failed joints. I bet you will see the correct grain structure. What about the other part types? Any failures? I assume this is standard 63/37 Eutectic solder? These aren't heart monitors or
Electronics Forum | Fri Jan 02 22:57:28 EST 2004 | darburch
We are also curently considering Flexa and would like any real world info. 1: has anyone had experience with flexa with/without the Aegis software? 2: Are the graphics as easily editted as Fujicam? 3: Is it easier to set the access to menus/options t
