Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs
We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee
Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris
Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
Electronics Forum | Tue Jul 16 11:12:18 EDT 2019 | jamesbowers
Time to get more solder paste and have no clearer ideas on the matter than last time. Going through the smaller jars on Digikey these two stand out (as I think they did last time!): One's Water Soluble (that's the one I got last time) and the other
Electronics Forum | Wed Dec 11 06:29:20 EST 2019 | ameenullakhan
Dear Javi, Thanks for the feedback and review. Sorry i was bit busy. Yes the issue is minimised, but not eliminated. We have tried with reducing the vibration source in chain conveyor of oven. Our board is having parts very next to each other. O
Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Thu Aug 08 22:41:30 EDT 2019 | orbitcoms
The pick n place height for component was set to 1.4mm but I had not allowed for pin thickness. I added this (total height now 1.6mm) and I get very few solder bridges now. I might try 1.7 and see if it makes any further differnce
Electronics Forum | Mon Aug 12 12:09:37 EDT 2019 | davef
First, companies should nor be venting solder process fumes into the workplace. Second, you should see medical attention, as Alexy suggested. It doesn't matter what caused you to get sick. Get fixed. Third, if your ex-employer is venting soldering
Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Wed Nov 20 09:23:53 EST 2019 | alpha1
We had a board we fought with for a while with solder balls. Checked everything, Stencil thickness at .004, reduced apertures, changed paste 3 times, changed profile 3 times. Finally changed board vendors. Went from HASL to Emersion Gold. Problem sol
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