Electronics Forum: board (Page 870 of 1638)

Soldering to Immersion Tin surface finish

Electronics Forum | Fri May 11 10:30:26 EDT 2001 | rkevin

I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be different? Solderpaste considerations? Anything else? In the past I have experienced selective non

Solder Paste Height

Electronics Forum | Thu May 17 12:59:09 EDT 2001 | rwilliams

I would like to know peoples' thoughts on measuring solder paste height. I am having difficulty fully understanding its value. Is it better suited to a production environment, or more of a lab environment? Our screen printers are not fitted with on-

Is more epoxy better?

Electronics Forum | Fri May 18 12:21:28 EDT 2001 | camohn

When it comes to how much epoxy [aka. "glue"] to dispense to hold a IC or any part with significant mass, on the bottom of a board for wave soldering, is more better? The way I see it, one good dot should be holding such a part on the PCB. If not, th

SMT Equipment

Electronics Forum | Thu May 24 15:10:23 EDT 2001 | caldon

ernman - From your question.........All the top PNP companies are good.....with that aside what is the requirements? High mix/low vol? Flexibility? High through put? Big Boards? Change over?Low mix/ high Vol.? This will help with ruling out companie

Info on OSP PCB�s

Electronics Forum | Thu Jun 14 21:20:23 EDT 2001 | davef

Aw, don't be such a baby!!! ;-) It's a blank of a lot cheaper than ENIG. Costs about the same as HASL, maybe even cheaper. Why not have your fab build-up a split a lot [er, maybe build a few extra, whatever.] next time you order your "favorite" b

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sat Jun 09 09:32:26 EDT 2001 | davef

Yes, your pallet will absorb / steal heat. It sounds like you are doing a good job in understanding the issues. Yes, the pallet could be the problem. Is this a new run that you are starting? Or has everything been OK, but recently you've begun to

Solder balls

Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment

Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.

Solder balls

Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment

Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away

X-ray vs AOI

Electronics Forum | Mon Jun 18 16:13:47 EDT 2001 | calipso

If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and i

What Else Are They Good For?

Electronics Forum | Mon Jun 18 19:37:02 EDT 2001 | Gil Zweig

You can use your x-ray inspection system to QC incoming multi-layer printed circuit boards. In particular you would want to insure drilling registration. A drilled, plated through hole, precipitously close to a ground plane can have , in time, copper


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