.gif)
Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf
@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the
Electronics Forum | Fri Apr 16 17:20:34 EDT 2021 | astarotf
We are currently producing a project that brings a TQFP64. But some boards do not solder the component well with its ideal fillet, some are well soldered when they come out of the reflow oven, but some are not. Can the pins be sulphated? How can we c
Electronics Forum | Wed May 05 05:41:02 EDT 2021 | jineshjpr
Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Solder
Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech
My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.
Electronics Forum | Thu Jan 27 20:17:25 EST 2022 | stephendo
What exactly counts as "always on"? Our ROHS wave solder machine is always on during the week but the pot shuts off at the end of the shift and turns on early in the morning so that the solder is melted before we get to work. It is only using a small
Electronics Forum | Mon Nov 22 22:16:18 EST 2021 | dontfeedphils
From what I remember it was pretty easy/straightforward. I'd grab an image of the bottom side of the panel from our AOI, scale it, and load it into the offline programming suite. Program flux and solder paths, then iron out the kinks online during th
Electronics Forum | Mon Dec 27 05:16:17 EST 2021 | jineshjpr
Hi Stephen, Thanks for your response. Since the OSP Finished PCB to be execute in mass volume, almost 3 to 4 weeks (Vacuum Sealed Pack) takes place prior to assemble. Although we are using SnPb 63-37 Type 4 solder paste for this single sided SMD asse
Electronics Forum | Wed May 25 23:45:04 EDT 2022 | SMTA-64387687
1. The jetting head flies very low to the level of the board. So, performing AOI function will crash the head. 2. AOI is performed close to the end of the line, after P&P or reflow. Are you planning to run the boards back-and-forth, on the line? 3. L
Electronics Forum | Fri May 27 12:34:20 EDT 2022 | SMTA-64387182
On my PCB fab drawings, I specify SOLDER MASK PER ANSI/IPC-SM-840, should I specify a CLASS rating? It appears at one time the CLASSES were 1, 2, or, 3. I believe, they are now T or H. Correct? Thanks, Joe
Electronics Forum | Tue Jun 14 14:57:29 EDT 2022 | glasscake
Check for warp during reflow or placement, if your board is bowing you are not going to make a good solder connection. If your board is warping during reflow you may need to make a currier to support the board during reflow if using the edge to tran
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
